The announcement will take place in China at 15:00 on April 16 at local time. This was reported on the official page of the brand in Weibo.
Redmic 10 Air will be the third device in the series after the Redmagic 10 pro+. From Teaser, the smartphone will receive an unusual rear panel design with a metal frame and three round elements.
There is no detail about the features yet, but the manufacturer may begin to share them as the presentation approaches.
According to names and leaks, RedMic 10 weather will vary especially in a thin state while maintaining game capabilities. Probably, innovation will inherit a strong cooling system, game chips and top “iron ından from senior models.
Source: Ferra
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