This technology will not appear in future Meteor Lake processors, but it is part of Intel’s roadmap for various future projects.

Gelsinger explained that Intel is working on creating 3D silicon, using technologies like EMIB and Foveros for composition, where one die will contain the cache and the other will handle processor calculations on top.

Intel’s decision comes as AMD technology has proven its superiority, powering some of the world’s fastest gaming processors and increasing the value of EPYC processors. Intel aims to leverage similar advantages of its technology.

Source: Ferra

Previous articleMTS opens pre-orders for the inexpensive HONOR 90 smartphone with a 120 Hz display
Next articleWhy FAW cars are interesting in Russia. A new Lada will be released on one of them
I am a professional journalist and content creator with extensive experience writing for news websites. I currently work as an author at Gadget Onus, where I specialize in covering hot news topics. My written pieces have been published on some of the biggest media outlets around the world, including The Guardian and BBC News.

LEAVE A REPLY

Please enter your comment!
Please enter your name here