This technology will not appear in future Meteor Lake processors, but it is part of Intel’s roadmap for various future projects.

Gelsinger explained that Intel is working on creating 3D silicon, using technologies like EMIB and Foveros for composition, where one die will contain the cache and the other will handle processor calculations on top.

Intel’s decision comes as AMD technology has proven its superiority, powering some of the world’s fastest gaming processors and increasing the value of EPYC processors. Intel aims to leverage similar advantages of its technology.

Source: Ferra

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