Samsung introduced advanced Gate-all-around (GAA) technology optimized for AI accelerators, as well as integrated Collaborative Optics (CPO) technology that enables high-speed processing with low power consumption.
The company aims to launch a comprehensive, integrated CPO-based AI solution by 2027, offering a unique turnkey AI platform combining “foundry, memory and advanced packaging (AVP) expertise.”
Additionally, Samsung introduced new foundry technology nodes such as SF2Z and SF4U for 2nm and 4nm process technology respectively. SF2Z process technology features an optimized power distribution network to improve power, performance and area for high-performance computing systems, and mass production is planned for 2027. This move will allow Samsung to compete with TSMC, which plans to include the same technology in the 1.5 nm process by 2026.
Source: Ferra
I am a professional journalist and content creator with extensive experience writing for news websites. I currently work as an author at Gadget Onus, where I specialize in covering hot news topics. My written pieces have been published on some of the biggest media outlets around the world, including The Guardian and BBC News.
