A20 and A20 Pro chips, produced using TSMC’s latest process technology, are expected to be introduced in this model. Currently, mass production of 2nm chips is limited due to low efficiency and high cost (up to $30,000 per silicon layer).
TSMC promises to increase production to 80,000 wafers per month by 2026, making the process more cost-effective.
Apple also plans to use Wafer-Level Multi-Chip Module (WMCM) technology, which will increase performance and reduce chip sizes.
According to estimates, iPhone 17 will receive 3nm A19 and A19 Pro processors in 2025, and the transition to 2nm process technology will only occur in the iPhone 18 series, but access to new chips will be limited due to the high cost.
Source: Ferra
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