Intel is actively supporting its goal of regaining technology leadership by 2025, with plans to introduce the Intel 18A and RibbonFET transistor structure by 2024. On the other hand, TSMC is working on N2 technology using nanosheets and aims to introduce it in 2025.
Wei also talked about the introduction of a new power-to-chip power supply scheme in N2 technology, which will increase the switching speed of transistors and increase their density.
Both companies recognize the importance of energy efficiency in their new technologies, as customers are paying more and more attention to it. As competition intensifies, advances in chip manufacturing are expected to drive further innovation and productivity in the industry.
Source: Ferra
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