This will be the company’s first process technology measured in angstroms, significantly outperforming the previous N2P. The main innovation is the back-side power supply (BSPDN) system.
Like 2nm processes (N2, N2P and N2X), the A16 chips will use ring transistors (GAA) but the technology is based on Super Power Rail innovation.
These and some other improvements will allow you to get a significant increase in performance and energy efficiency compared to N2P:
- Up to 10% higher frequency at the same voltage.
- 15-20% lower power consumption at the same frequency and chip complexity.
- A 7-10% increase in transistor density is possible.
The highlight of the A16 is its advanced Super Power Rail (SPR) system for power distribution. It is specifically designed for AI and high-performance processors that require complex signal wiring and power-intensive networks.
This system improves transistor density and power supply, which are critical to performance. TSMC is one of the most complex to implement and is probably the reason why BSPDN has been abandoned in N2P and N2X processes (increased production costs).
Mass production of the A16 is planned for the second half of 2026, with the first chips expected in 2027. By then, the A16’s main competitor is expected to be Intel’s 14A process technology.
Source: Ferra
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