The system is being developed under the guidance of MAI senior lecturer Maxim Korobkov and student Alexey Stepanov. It uses a neural network trained on special test coupons that predicts possible deformations and makes appropriate changes to the card design.
This technology aims to reduce the time and material costs for the production of multilayer circuit boards, which is especially important for electronics manufacturers and companies involved in the development and production of electronic components.
The project is expected to be completed by the end of 2025, after which the technology will be ready for application in enterprises specializing in the production of electronic equipment.
Source: Ferra
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