The company’s CEO, Jensen Huang, explained that the issues are related to the layout of the graphics chips, which sees the internal layers shift when heated and cooled. This causes misalignment of components and can lead to failures.
The main challenge came from the use of TSMC’s CoWoS-L packaging technology, which requires complex interconnects to transfer data at speeds of up to 10 TB/s.
Even the slightest misalignment can disrupt the entire system. NVIDIA engineers are currently working to replace the chip’s top metal layer, but if this solution doesn’t produce the desired effect, the company may cancel the current project and start developing a new chip from scratch.
The latency affects both professional Blackwell chips and consumer models, including the RTX 50XX series gaming graphics cards.
Source: Ferra
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