This new product promises to make SSDs with capacities over 100 TB more affordable. Compared to its 238-layer predecessor, the chip increases data transfer speed by 12% and reading performance by 13%. Energy consumption is also reduced by more than 10%.
SK Hynix attributes this success to its “Three Plug” technology, which optimizes electrical connections, speed and efficiency. The chip also uses low-voltage material and “alignment correction” to improve manufacturing processes.
Production will begin in 2025 and will focus on AI data centers.
Source: Ferra
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