These powders are used to form conductive layers in the Cermet chips. Electronic components depend on their quality, depending on the quality of electronic components. So far, Russian businesses have often acquired such materials in China, but suppliers have not always guarantee the stability of the features.
Young scientists proposed a method based on the hydrogenation of the paravatramate and ammonium paramolibdate mixture. They managed to choose optimal processing conditions to obtain dust with controlled particle size. Technology has gone through production tests, where impressive results show.
On the basis of a new dust, it was revealed that a pasta paste allowed you to create the conductor layers twice in compared to the analogs currently used. This increases the intensity of metallization and reduces the likelihood of defect by reducing resistance.
As developers explained, the smaller the particles of the dust, the more complex geometry of the conductive paths can be created. This is particularly important for modern microelectronics that it is constantly necessary to reduce the size of the components.
Source: Ferra
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