The processor and the memory will directly integrate into the plate level without using intermediate substrates. This will increase the thermal properties, reduce energy consumption and increase data fighting rate.
By combining the filling and molding stages, WMCM uses the MUF (Molding Lower Filling) method that reduces the number of materials and processes that increase the efficiency and output of the appropriate chips.
When such a solution is combined with the transition to N2, it will provide a noticeable increase in performance and autonomy.
Apple’s main emphasis will do tasks about artificial intelligence and games. A memory arrangement closer to the processor will accelerate the calculation, especially in welding intensive scenarios.
The launch of the iPhone 18 is expected in the II half of 2026, and the new features of the chip should prepare a smartphone for AI’s mass implementation period.
Source: Ferra
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