At the conference, Hot Chips Nvidia brought plans for the fotonic use of silicone and optical packaging (CPO) technology. This approach will reduce energy consumption, reduce delays and simplify the architecture of data centers. Unlike removable optical modules in which the signal has a long electric pathway into the light, CPO placed an optical module directly to the ASIC, which reduces losses and reduces energy consumers almost three times.
At the beginning of 2026, NVIDIA will release the Quantum-X’s infiniband-communications with 144 GBİT/S 144 port and 115 tbit/s bandwidth. These devices will be equipped with liquid cooling and integrated data processing to reduce delays. In the second half of 2026, the Spectrum-X photonic ethernet platform, including two solutions, will appear: 102.4 TBIT/S and SN6800 bandwidth designed for 409.6 TPIT/S.
The company claims that such systems can change thousands of separate components in the infrastructure of data centers. This will accelerate the deployment, simplify care and increase the reliability of the business. According to Nvidia, new optical solutions will be an important factor in creating scalable clusters for productive artificial intelligence.
NVIDIA plans are synchronized with the TSMC road map for the Coupe platform, which will develop in three stages and gradually increase the efficiency of optical modules between 1.6 to 12.8 tbit/s. According to the company’s statements, the use of CPO will not be an additional option, but a prerequisite for future data centers.
Source: Ferra
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