This significantly exceeds the JEDEC standard for HBM4 (8 GBIT/S and 2 TB/S). According to the CEO of Sanja Mehrotra, Micron HBM4 memory is in front of competitors in both speed and energy efficiency.
It is based on branded 1γ drama, advanced CMOS logic and new packaging technologies. In 2026, materials are expected to expand.
Micron also presented plans for HBM4E, which is planned for 2027 with TSMC. In addition, the company confirmed the development of the GDDR7, which can work at speeds up to 40 GBIT/S and can be achieved by capacity more than 1.5 TB/s. Nvidia has already chosen Micron Solutions for future GPUs.
Source: Ferra
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