This means buyers can choose a configuration that suits their needs without overpaying for unnecessary power; for example, maximum graphics with a standard number of processor cores or vice versa.
Both chips will be manufactured on TSMC’s 3nm N3P process and use the new SoIC-MH packaging, which offers better thermal conductivity, compactness and power efficiency. This will increase consistent performance with less heat.
Apple is expected to introduce the new MacBook Pro at the end of October, but there may be a slight delay in its launch.
But even then Apple will maintain the lead; Competitors like the Snapdragon X2 Elite Extreme are even inferior to the current M4 Max in terms of performance.
Source: Ferra
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