Intel showcased several soon-to-be-released products at the VisiON event to showcase its packaging technologies. Japanese PC Watch took the opportunity to share some photos of various Meteor Lake products called fourteenth-generation Core processors. Also discussed are Sapphire Rapids and Ponte Vecchio for data centers.
An Alder Lake bundle (left) alongside the Meteor Lake variant.
Meteor Lake will be the first generation of consumer chips to use the chips, as can be seen in the images. There is a variant with a regular package and a more compact version, the latter is expected to be used in economical ultra-compact systems. Both seem to offer the same configuration consisting of a compute die (Intel 4), a SoC LP chip (TSMC N4/N5), and a gpu die (TSMC N3). The first products with this design are expected to be released later in 2023.
In addition, the manufacturer has shown some products for the professional market. In addition to the Sapphire Rapids Xeon server processors (with and without hbm2e), the 47-tile Ponte Vecchio accelerator is also on display. As with Meteor Lake, Intel assembles these chips using the Foveros packaging technique.
Sources: PC Watch, via Videocardz
Source: Hardware Info
