The chip will allow Samsung to create larger capacity DIMMs, which was previously impractical. These include 1TB memory modules built from 40 stacks of 8 Hi 3DS memory using eight 32GB memory devices. As overwhelming as it may seem, this massive amount of memory is invaluable to AI, big data, and database servers, providing the processing power needed to solve complex problems.
Previously, AMD had put an end to rumors of a possible deal with Samsung on the production of future chips for data centers. They said Samsung had an order for 4nm chips from one of their big data center customers, possibly AMD.
Source: Ferra
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