Intel Executive Vice President and Chief Operating Officer Keyvan Esfarjani said Intel’s advanced packaging technologies help the company’s customers beat the competition in terms of performance, size and design flexibility in chip products.
As the entire semiconductor industry enters the era of heterogeneous integration of multiple “chips” into a single package, advanced packaging technologies such as Intel’s Foveros and EMIB (embedded multi-chip bridge) can integrate up to a trillion transistors into a single package, and beyond 2030 We will continue to comply with Moore’s Law.
Source: Ferra
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