Traditional electronics manufacturing methods rely on horizontal integration, where components are arranged in the same plane. However, 3D integration allows the creation of multilayer structures that significantly increase component density and reduce device size.
As part of their research, the researchers developed a new type of 3D integration called monolithic 3D integration (M3D). This approach allows transistors to be built layer by layer on the same substrate, making devices more compact and energy efficient.
Scientists have used 2D materials such as graphene and molybdenum disulfide to create chemical transistors and memtransistors. These components are integrated into a multi-layered structure to provide high density and movement speed.
One of the key advantages of the new approach is the low temperature of the production process, making it compatible with existing semiconductor manufacturing technologies. This means the new chips can be easily integrated into modern electronic devices.
The scientists demonstrated the working of their chip by using it to identify and classify various chemicals. Chemical transistors responded to different sugar concentrations, and memtransistors processed the received signals.
Source: Ferra
I am a professional journalist and content creator with extensive experience writing for news websites. I currently work as an author at Gadget Onus, where I specialize in covering hot news topics. My written pieces have been published on some of the biggest media outlets around the world, including The Guardian and BBC News.
