The company has completed the design of logic chips for HBM4 and started trial production on 4nm process technology. This study is being conducted at a dedicated D1c facility. The new memory is expected to provide data transfer speeds of up to 2 TB/s and support a 2048-bit interface with a bandwidth of 6.4 GT/s. Additionally, HBM4 will have a capacity of up to 48 GB, which is 33% more than existing solutions.
The next generation memory will be used in Nvidia’s Rubin GPU platform, which will be released in 2026.
Source: Ferra
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