Although the mass production of such chips has not been expected before the end of 2026, Apple will probably be the first customer of this technology. A20, even before silicone plates are divided into separate chips, various components, CPU, GPU and memory will be created on the basis of the so -called wafer level module packaging, which allows you to place CPU, GPU and memory at the same level.
This will give Apple the opportunity to reduce the physical dimension of the chip, maintain energy efficiency and increase efficiency without energy consumption. However, as resources indicate, the amount of ram in these devices will not change and will remain at 12 GB as in the current generation.
TSMC production capacities for WMCM packaged chipset will be located in the Chiayi AP7 field. At the end of 2026, the company is waiting to produce 50 thousand chips per month.
Most likely, the other iPhone 18 models will not receive new A20 chips and maintain the previous information packaging used in previous generations. Therefore, the differences between pro versions and standard will become more noticeable.
Source: Ferra
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