According to the statement, the fee is designed for Panther Lake H chips with a heat pack up to 25 W, which shows the use of compact mini-PK or built-in systems.
RAM DDR5 SO-DIMM up to 128 GB is supported by a frequency up to 7200 mt/s. M.2 slots are provided for storage and extensions (NVME, Wi-Fi/BT, 4G/5G) and a PCIe Gen5 X4.
The interface set includes USB-C with DisplayPort ++, HDMI 2.0, Power Distribution Support, Intel 2.5GBE Networking Point up to three, com ports, sound jackets and SATA. Thus, the solution seems to be an industrial platform that emphasizes broad compatibility.
The Panther Lake on the mass devices is expected only in 2026, so the leak shows that OEM partners are already actively testing a new generation.
Source: Ferra
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