Initially, another land was chosen for the facility in the neighboring area, but plans were changed in favor of a larger area. The project is called one of the largest US in the field of packaging and testing of micro circuits. The implementation should reduce the dependence on Asian enterprises, where the final stages of the American industry are concentrated in traditionally concentrated.
Considering the emergence of new TSMC and Intel factories in the United States, a significant portion of the finished plates are still sent to Taiwan and South Korea for the final processing. Such an imbalance was particularly acute during the growth of demand for AI chips when the packaging capacity was limited.
The future facility in Arizona will participate in advanced packaging methods used in the production of high -performance processors. These include NVIDIA graphic processors and Cowos and information technologies used in apple chips. TSMC has entered into an agreement on transferring some of its products to the new amkor site, which will reduce the logistics time.
Source: Ferra
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