The presentation took place at the SEDEX 2025 exhibition in Seoul, where the company demonstrated the technological process of next-generation high-speed memory, which is the key to the development of artificial intelligence computing.
According to DigiTimes, the efficiency level of Samsung’s suitable HBM4 logic crystals has reached 90%, indicating that the debug phase is complete and ready for mass production.
The company aims to avoid the mistakes of the past years, when it lost its position in the DRAM segment, and now relies on the high performance and scalability of its solutions.
Samsung also plans to attract major customers like NVIDIA by offering competitive prices, increased supply volumes and record data transfer speeds of up to 11 Gbps, faster than SK Hynix and Micron.
Experts believe that with the release of HBM4, competition in the memory chip market will become especially intense.
Source: Ferra
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