Known as the Chiplet, this approach has been adopted by major players such as AMD, Apple, Amazon, Tesla, IBM and Intel. With the declining payoff of Moore’s Law, which states that the number of transistors on a microchip doubles roughly every two years, packaging smaller chips has become critical.
Chiplets offer a number of benefits, including lower manufacturing costs and superior performance when multiple chips are combined. Driven by advanced packaging technology, this strategy is revolutionizing the semiconductor industry with a significant impact in areas such as artificial intelligence, driverless cars and military equipment.
However, one of the main problems is that, like chip manufacturing, chip packaging is largely dominated by Asian companies. In an attempt to revive domestic chip manufacturing, the US government passed the CHIPS Act, a $52 billion subsidy package aimed at boosting chip production in the United States.
The US Department of Commerce is currently accepting applications for manufacturing development grants.
Source: Ferra
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