Chinese nand flash manufacturer YMTC has developed a 128-layer flash memory that performs well in terms of speed and density thanks to its Xtacking architecture. The chip consists of parts that are produced on separate wafers and then put together. Their revenue is now 100,000 wafers per month, according to DigiTimes. By the end of 2023, this will more than double, giving the company 7 to 8 percent of the world’s nand-flash production.
The 192-layer design is expected to be on the market later this year. The first samples have already been sent to some commercial customers. The number of tiers does not always say anything about the characteristics and performance of a generation. Micron was the first company to develop 232 layers, where Kioxia with 162 layers and Western Digital had a denser and faster product than the competition with 176 layers. Market leader Samsung is expected to break the 200-layer barrier this year.
Source: ComputerBase
Source: Hardware Info
