Judging by a leaked photo of Asus’ upcoming X670 motherboard, AMD’s high-end X670 will consist of two chipsets. There have been rumors of dual-chip designs before, but it really looks like there will be two separate chipsets.
The photo was shared on China’s Baidu and excitementand it would be from an Asus motherboard for the Ryzen 7000 series expected later this year: the Asus Prime X670-P WiFi. In addition to space for the new AM5 socket and four memory banks (probably just DDR5), we see traces of a chipset in two places. There could be two B650 chipsets in there, which could mean double the I/O connections compared to mid-range B650 motherboards.
AMD is expected to show more of its B650 and X670 chipsets at next week’s Computex trade show. Asus will likely announce a few things here as well, like Asrock, which already has a livestream on YouTube.
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excitement
Source: Hardware Info
