High-NA EUV technology is game-changing: transistor sizes are expected to shrink by 66%, allowing more transistors to fit into the same silicon area, improving both power efficiency and performance.
Featuring a numerical aperture of 0.55 compared to the previous 0.33, the new systems provide greater accuracy and more complex molding capabilities. These advanced machines are much larger and require transport by up to three Boeing 747 aircraft.
TSMC is reportedly making progress on 2nm process development, planning to start development of N3X and N2 in the second quarter of 2025, and begin mass production of N2P and A16 in the second quarter of 2026. 2nm process technology promises 10-15% performance increase and 25-30% reduction in power consumption.
Source: Ferra
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