The GB10 was built on the basis of G-DIE for two crystal-S-DIE and GPUs for CPU and memory made according to the TSMC N3 process process. Each CPU set (10 cores) has 16 MB L3-KESHA, only 32 MB.
The GPU is equipped with support for 5th generation tensor seeds, nuclei for monitoring rays and DLSS 4th. Pik performance reaches 31 TFLOP FP32 and 1000 Tops FP4.
At the same time, the memory is held with a 256 bit LPDDR5X-9400 interface and a total capacity of up to 128 GB in total. Yield is 301 GB/s. NVLink C2C is used to transmit CPU and GPU. The chip is also equipped with 16 MB L4-KESHA system.
Up to four screens (8k 120 Hz), PCIe Gen5, Ethernet are supported via PCIE and energy consumption is announced in 140 Watt.
Although the DGX spark is not focused on the mass market, GB10, PCs and laptops give an idea about future Nvidia arm chips.
Source: Ferra

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