Rumor has it that the iPhone 18 may have a 2nm chip with new packaging

The iPhone 18, which will arrive only in 2026, will have a new 2-nanometer lithography chip and will bring structural changes to the device system. According to knowledgeable Mobile Phone Chip Expert, Apple will also change the packaging format of the components.

Several rumors have indicated that the iPhone 17 will be the model to introduce the 2nm chip in Apple devices. However, an insider points out that this will only happen in the next generation, probably with the A20 chip produced by TSMC. According to the information provided by analyst Ming-Chi Kuo, the model 17 should use a SoC with a slightly larger manufacturing process around 3 nm.

In addition to the chip lithography issue, the company will change the InFO (Integrated Fan Output) packaging format to WMCM (Wafer-Light Multi-Chip). This way the manufacturer’s idea is to have more internal flexibility to arrange the parts the way you want.

iPhone 18 must have 12 GB RAM

While these terms are far from public understanding, InFO is an encapsulation technique that allows the integration of components, including memory, into a single die footprint. WMCM, on the other hand, enables more efficient communication between hardware as well as more complex packaging where the manufacturer can place parts vertically or horizontally.

The iPhone 18 should also have 12 GB of RAM. This is one of the most awaited changes by users but it has not seen the light of day yet as the iPhone 16 series retains the 8 GB specification.

Even with so many rumors, the iPhone 18 is expected to arrive only in mid-2026. Apple is likely to make a lot of changes to the project by then, so it’s best to wait until the official announcement in two years.