Before the event of the August 18the company had previously released some details about its latest flagship. Lenovo further presents the model by releasing details about the cooling mechanism of the gaming smartphone Lenovo Legion Y70.
The Legion Y70 has a vapor chamber of 5.047 mm2 with a thickness of 0.55 mm, the thickness of the profile is quite thin, while the base has a total thickness of 0.8 mm without camera, in addition, the Legion Y70 is equipped with a excellent 50MP camera with OIS, and there are 10 layers of heat dissipation mechanisms and materials that provide the device with excellent cooling.
As we know, the Legion Y70 is designed with solid gaming credentials, but it also has an attractive design that will suit even the average customer, and while some gaming components, such as the top-side triggers and a game-focused UI, are absent, the phone is well prepared for gaming with its Snapdragon 8+ Gen 1 SoC16GB RAM and support for 68W fast charging.
The device’s excellent cooling mechanism also adds to the mix to make it a worthy purchase. More details will follow as we get closer to the official presentation of the Lenovo Legion Y70.
Source: Lega Nerd
