It was previously reported that Apple received about 90% of TSMC’s capacity, but this figure has increased to 100% due to delays in supplying wafers from Intel. This is expected to affect the production of 3 nm chips, which will decrease from the previously estimated 80-100 thousand units to 50-60 thousand wafers per month in Q4.
The upcoming iPhone 15 Pro models are said to include the A17 Bionic chip, a first for TSMC’s N3B process, providing enhanced power efficiency and performance.
The M3 processor for Macs and iPads is also expected to be made using the 3 nm process.
Source: Ferra
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