The chip uses ultrasonic modulation technology to provide pressure pulses that trigger measured micro-movements in the air. The solid-state fan weighs less than 150 mg and is only 1 mm thick. The XMC-2400 is capable of moving up to 39 cm3 of air per second at a back pressure of 1000 Pa.
The fan’s developers say their product will help cool modern ultra-thin devices, which can’t even be equipped with micro fans due to their size. This chip has no moving parts, reducing the risk of breakage, and also offers IP68 dust and moisture protection.
The XMC-2400 can be installed on almost any motherboard and processor, as well as other components of smartphones and tablets.
Source: Ferra
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