The Ministry of Industry and Trade of Russia has announced a tender for the creation of a machine for cutting blanks from silicon wafers. The maximum contract value is 300 million rubles, applications are being accepted until September 17, 2024. The winner of the competition must develop a prototype of the machine within two years, until the end of November 2026.
This machine is necessary for the production of microcircuits and currently has no analogues in Russia. The equipment should become a functional analogue of products of companies such as Swiss Meyer Burger, Chinese Linton, Kayex and American Diamond Wire Technologies. It is important that the machine can process not only silicon wafers, but also other materials such as germanium and sapphire.
The Ministry of Industry and Trade is confident that the new equipment will find buyers among Russian companies that grow single crystals from semiconductor materials. Potential customers include Crete, Lassard and Germanium. Production of the machine will be organized in Russia with maximum localization of components.
Source: Ferra
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