The first option proposed by the US government includes the construction of a developed chip packaging center in the country. This step will allow TSMC to offer a full service cycle from the production of plates to the end of the plate, which can reduce the company’s dependence on Taiwan.
The second option allows the creation of a joint venture with Intel Foundry (IFS). At the same time, TSMC can invest in the development of IFS and even transfer some of its technologies. However, such a step can lead to loss of leading TSMC positions in the market, which makes this option extremely controversial for the company.
The third option is the translation of TSMC orders for American customers in the capacity of Intel Foundry. In this case, the largest customers such as Apple will have to order IFS and TSMC will lose a significant portion of income. However, it is unclear whether Intel can achieve the same level of quality and performance as the Taiwan giant.
Source: Ferra
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