Honor Magic V2 Flip is expected to equip with a user LTPO display and work on the chip of the Snapdragon 8 Gen 3. The past Magic V Flip is equipped with a 6.8 -inch folded OLED display and Snapdragon 8+ Gene 1 chip.
Meanwhile, Honor Magic V4 will be equipped with an 8 -inch folded LTPO screen and lateral fingerprint sensor. The Snapdragon 8 Elite will work on the chipset, will compete with the Oppo Find N5, but the honor version is expected to be a 8 -core chip instead of 7.
As for the cameras, Magic V4 will be equipped with a 50 MP with a main sensor and a phone lens, although it does not have a flagship level. Honor also works to reduce the thickness of the device.
Both folding phones are expected to be available in June.
Source: Ferra
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