Built on 4nm technology, this eight-core chip includes four ARM Cortex-A715 and four Cortex-A510 cores, as well as a Mali-G615 GPU.

It promises significant improvements in performance and energy efficiency compared to previous models.

Advances in artificial intelligence are particularly impressive; MediaTek claims up to three times faster AI performance and eight times faster transformative productive AI models than previous models.

This puts the Dimensity 8300 on par with Qualcomm’s recently announced Snapdragon 7 Gen 3, making it a serious competitor in the mid-budget segment.

It also supports Dimensity 8300, 5G, Wi-Fi 6E, 4K60 video, UFS 4.0 memory and promises high speed.

The first smartphones with this chip are expected to be released at the end of 2023. Most likely, the new product will appear on devices from brands such as OPPO, Vivo and Redmi, which used previous Dimensity models.

Source: Ferra

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