The uniqueness of the system lies in the mechanism that automatically extends the back of the laptop when the lid is opened. This opens additional vents and increases space for air circulation.
There’s no word yet on whether this laptop will go on sale, but since it’s already won the iF Design Guide Award, photos and some details are available.
The back of the laptop is driven by the Hinge Automatic Extension mechanism, which enables “automatic extension of the thermal module using a gripping mechanism,” according to the award description.
Wistron claims that typically the motherboard and “thermal component” are stacked on top of each other, which doesn’t provide enough room for air circulation. The new system moves the “thermal module” a little further back.
In theory, this could help thin laptops slightly increase their cooling efficiency.
Source: Ferra
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