Renowned analyst Ming-Chi Kuo has reported that Apple no longer plans to use copper with resin for the motherboards in the iPhone 17.
Copper foil coupled with epoxy resin allows for a thinner version of the circuit board. This, in turn, provides more internal space for other components and sensors in future iPhones.
Now the Cupertino company has abandoned these plans due to the fact that such a solution “does not meet Apple standards.”
There were also hearing aids that Apple had previously considered using in another device, like the Apple Watch. However, it is unclear whether the changed plans included that device.
Source: Iphones RU
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